GIGABYTE's B860 AORUS ELITE WIFI7 ICE motherboard represents a compelling offering in the mid-to-high-end ATX motherboard segment. Designed for users building powerful and aesthetically pleasing systems, this motherboard boasts an impressive array of features, including support for the latest Intel Core Ultra 200S CPUs, robust power delivery, cutting-edge connectivity options, and a striking silver-grey and white color scheme. This in-depth review will explore its key features, performance capabilities, and overall value proposition.
Design and Aesthetics: A Fusion of Performance and Style
The B860 AORUS ELITE WIFI7 ICE immediately captivates with its unique silver-grey and white color scheme. This departure from the traditional black motherboard aesthetic is refreshing and lends itself perfectly to white-themed builds. The silver-grey PCB is accented by white accents on the heatsinks and I/O panel, creating a visually appealing contrast. The AORUS logo, integrated into the design with a futuristic, almost mecha-inspired aesthetic, adds a touch of branding without being overwhelming.
The strategic use of white on the I/O connectors further enhances the overall aesthetic cohesion. While the white accents aren't pervasive, they're precisely placed to create a sophisticated and modern look. The back of the PCB continues the theme, with a darker grey color scheme and subtly integrated white AORUS branding. This attention to detail extends even to the subtle lighting effects: a soft white glow emanates from the VRM heatsink and I/O cover area, complemented by a blue glow from the PCH heatsink.
The board's dimensions are a standard ATX form factor (30.5cm x 24.4cm), making it compatible with a wide range of cases. The 6-layer 2oz Copper PCB construction promises enhanced signal integrity and durability. GIGABYTE's commitment to a premium build is evident in the high-quality components and careful consideration given to both performance and visual appeal.
Core Components and Specifications
The B860 AORUS ELITE WIFI7 ICE is built around several key components, each contributing to its overall performance and stability:
Intel Core Ultra 200S Processor Support and LGA 1851 Socket
This motherboard fully supports the latest Intel Core Ultra 200S series processors using the new LGA 1851 socket. While physically similar to the LGA 1700 socket in terms of dimensions (37.5mm x 45.0mm), the LGA 1851 boasts a significantly increased pin count (1851 pins) and a different pin arrangement, ensuring backward incompatibility with previous-generation CPUs. The repositioned keying mechanism (from the left to the right side) further prevents accidental misalignment during installation. The socket’s opening mechanism, similar to that of the LGA 1366, involves counter-rotating levers for secure and simple CPU installation. This makes it easy to install or remove the CPU even with only basic experience. Notably, the physical dimensions allow for compatibility with existing coolers designed for LGA 1700.
The Intel Core Ultra 200S series, based on the Arrow Lake architecture, signifies a significant advancement in CPU technology. Manufactured using TSMC's 3nm process and incorporating Intel Foveros 3D stacking technology, these CPUs offer improved performance and efficiency. The key architectural enhancements include:
- Hybrid Core Architecture: Retains the efficient P-cores and E-cores, optimizing performance across various workloads. While P-cores lose Hyper-Threading, they benefit from significantly increased clock speeds, reaching up to 5.7 GHz. E-cores also see a boost, reaching up to 4.6 GHz.
- Integrated AI NPU: The inclusion of an AI NPU provides 13 TOPS of compute power, accelerating AI-related tasks and enhancing performance in applications that leverage AI processing.
- High-Speed Memory Support: Full support for both UDIMM DDR5 and CUDIMM DDR5 memory modules, with native support for DDR5-6400 speeds and even higher overclocking potential.
- PCIe 5.0 Support: The CPU provides 20 PCIe 5.0 lanes and 4 PCIe 4.0 lanes, enabling support for the latest high-speed peripherals and graphics cards.
Intel's launch strategy for the Core Ultra 200S series involves a phased rollout, with unlocked K-series and KF-series (overclockable) SKUs launched in October 2024 followed by standard voltage and low-power T-series variants in January 2025.
Intel B860 Chipset: A Refined Platform
The Intel B860 chipset represents a modest but meaningful upgrade over its predecessor, the B760. Key improvements include:
- Enhanced Memory Support: Support for memory overclocking, extending the achievable speeds beyond the base specifications.
- Faster DMI: Utilizes a DMI 4.0 x4 interface for improved communication between the CPU and the chipset.
- Increased PCIe 4.0 Lanes: The number of PCIe 4.0 lanes provided by the chipset has increased from 10 to 14.
- Native USB4 Support: Adds native support for one TB4/USB4 interface, complementing the existing USB 3.2 and USB 2.0 interfaces.
This refined chipset ensures robust performance and compatibility with a wide range of peripherals.
Robust Power Delivery System: 14+1+2+1 Phase 60A DrMOS
The B860 AORUS ELITE WIFI7 ICE motherboard features a highly capable 18-phase VRM (Voltage Regulator Module) design, ensuring stable and reliable power delivery to even the most demanding Core Ultra 200S processors. The breakdown is as follows:
- 14 Phases for vCore: Dedicated to powering the CPU's core voltage, providing ample headroom for both stock operation and substantial overclocking.
- 1 Phase for VCCGT: Dedicated to the integrated GPU (iGPU).
- 2 Phases for VCCSA: Dedicated to the CPU's integrated memory controller (IMC).
- 1 Phase for VNNAON: Dedicated to other motherboard components and low-power devices.
Each phase utilizes onsemi NCP302155 60A DrMOS power stages. These high-current power stages are capable of delivering substantial current, leading to improved stability and reduced temperature under heavy load conditions. The vCore section alone boasts a total output of 840A, underscoring GIGABYTE's commitment to reliable power delivery. The chipset also uses high-quality components such as metal alloy power chokes and 5K low-ESR solid capacitors, further enhancing the VRM's stability. The inclusion of dual 8-pin ATX power connectors provides sufficient power even for the most power-hungry Intel Core Ultra 9 series CPUs.
The expansive aluminum heatsink covering the VRM efficiently dissipates heat, ensuring that the MOSFETs operate within safe temperature ranges even during intensive workloads. The high-performance thermal pads further improve heat transfer.
Memory Support: DDR5-9200+ OC Potential
The motherboard features four DDR5 DIMM slots supporting up to 64GB per slot for a maximum capacity of 256GB. It supports dual-channel memory operation with a 2-slot-per-channel configuration and employs SMT (Surface Mount Technology) sockets. The optimized memory traces, coupled with GIGABYTE's AI-driven PCB design and 6-layer mid-loss 2oz Copper PCB, effectively minimizes signal interference and contributes to stable high-frequency memory operation.
The motherboard officially supports DDR5-9200+ OC speeds, with support for Intel XMP profiles. Testing with a high-end Core Ultra 9 285K CPU and v-color Manta XFinity RGB DDR5-9466 memory modules demonstrated successful overclocking to DDR5-9066 CL46 in Gear 4 mode and DDR5-8800 CL46 in Gear 2 mode. Gear 2 mode, while more demanding on the CPU IMC, offered noticeably improved memory read/write/copy performance with lower latency.
Expansion and Connectivity: Extensive Options for Modern Peripherals
The GIGABYTE B860 AORUS ELITE WIFI7 ICE provides a comprehensive array of expansion and connectivity options, satisfying the needs of demanding users:
PCIe Expansion: High-Speed Connectivity for Graphics and Peripherals
Three PCIe x16 slots are available:
- PCIEX16: Supports PCIe 5.0 x16, directly connected to the CPU, ideal for high-end graphics cards. The slot is reinforced with GIGABYTE's PCIe UD Slot X design and Ultra Durable PCIe Armor for added durability and stability.
- PCIEX11 and PCIEX12: Support PCIe 4.0 x1 and are connected to the B860 chipset.
The inclusion of PCIe EZ-Latch Plus allows for tool-less removal and installation of graphics cards, simplifying the maintenance process.
M.2 SSD Support: High-Speed Storage Solutions
The motherboard offers three M.2 slots:
- M2A_CPU: Supports PCIe 5.0 x4 and is connected directly to the CPU, enabling incredibly fast NVMe SSD speeds. This slot has a dedicated M.2 Thermal Guard heatsink.
- M2QSB and M2NSB: Both support PCIe 4.0 x4 and are connected to the B860 chipset. These two slots share a larger M.2 Thermal Guard Ext. heatsink.
All M.2 slots are equipped with thermal guards and feature M.2 EZ-Latch Plus for easy tool-less installation and removal of NVMe SSDs, further enhancing user convenience.
SATA Storage: Additional Storage Options
Four SATA 6Gbps ports, connected to the B860 chipset, provide further storage expansion options and support RAID 0, RAID 1, RAID 5, and RAID 10 configurations.
USB Connectivity: Extensive Ports for Peripherals
The B860 AORUS ELITE WIFI7 ICE offers an extensive array of USB ports:
- 1x USB4 Type-C: Supports up to 40Gbps data transfer speeds, DisplayPort Alt Mode (up to 3840x2160@144Hz), and backward compatibility with USB 3.2, 10Gbps, and USB 2.0.
- 2x USB 3.2 Gen2x1 10Gbps Type-A: Offer fast data transfer speeds.
- 4x USB 3.2 Gen2x1 5Gbps Type-A: Provide additional high-speed USB connectivity.
- 4x USB 2.0: Offer support for legacy USB devices.
Additionally, a front panel USB 3.2 Gen 2x1 10Gbps Type-C connector is available for improved accessibility.
Display Output: Versatile Display Options
The motherboard provides both HDMI 2.1 and DisplayPort 2.1 outputs, ensuring compatibility with a wide range of displays. The HDMI 2.1 port supports up to 4K@60Hz, while the DisplayPort 2.1 port supports up to 4K@144Hz, providing flexibility for different display resolutions and refresh rates. A front panel HDMI 1.4 connector is also included.
Networking: High-Speed Wired and Wireless Connections
The B860 AORUS ELITE WIFI7 ICE utilizes Realtek's RTL81250 2.5G LAN controller, capable of handling network speeds up to 2500Mbps for significantly faster data transfers. For wireless connectivity, it features the Realtek RTL8922AE Wi-Fi 7 module, supporting IEEE 802.11be (Wi-Fi 7) with 2x2 160MHz dual-band operation, covering the 2.4GHz, 5GHz, and 6GHz bands. This delivers superior throughput, lower latency, and broader bandwidth compared to previous generations. Bluetooth 5.4 is also integrated. The included antenna features a magnetic base for easy attachment and the WIFI EZ-Plug makes antenna installation quick and simple.
Audio: High-Quality Audio Solution
Audio is handled by a Realtek ALC897 audio codec, which supports 7.1 channel surround sound and S/PDIF optical output. High-quality audio capacitors contribute to a more immersive and realistic audio experience.
RGB Lighting: Customizable Illumination
The motherboard supports both standard 12V 4-pin RGB and 5V 3-pin ARGB lighting devices, providing ample options for customization. The 12V RGB header outputs 12V 2A 24W, while the three 5V ARGB headers output 5V 3A 15W each. Users can control the lighting effects through GIGABYTE's RGB Fusion software, enabling personalized lighting schemes.
EZ Debug Zone: Simplified Troubleshooting
The EZ Debug Zone simplifies troubleshooting by providing LED indicators for various components and a set of easily accessible buttons for power, reset, and BIOS flashing (Q-Flash Plus). The multi-function reset button can also be configured for functions such as RGB control, direct BIOS entry, and safe mode boot within the BIOS settings.
Overall Impression: A Strong Contender in the Mid-to-High-End Market
The GIGABYTE B860 AORUS ELITE WIFI7 ICE motherboard stands out as a well-rounded offering for users building mid-to-high-end systems. Its striking silver-grey and white aesthetic, coupled with its robust feature set and excellent build quality, makes it a compelling choice. The use of high-quality components in the VRM, the extensive connectivity options, and the user-friendly features such as the EZ-Latch mechanisms and EZ Debug Zone make assembling and managing a system incredibly straightforward. While an even greater emphasis on white accents in the PCB design might be desired by some, the overall aesthetic is undoubtedly appealing. The motherboard's robust feature set, coupled with its fair pricing, makes it a very strong contender in its price bracket.